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12 kV固體柜環(huán)氧澆注模塊外表面無(wú)金屬化層時(shí)的電場(chǎng)分布特征研究

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   固體絕緣技術(shù)在中壓特別是12 kV開(kāi)關(guān)設(shè)備當(dāng)中已經(jīng)得到廣泛的認(rèn)可與應(yīng)用。為實(shí)現(xiàn)固體柜產(chǎn)品小型化、提高耐候性、安全性等目的,在固體柜絕緣表面進(jìn)行金屬化處理成為當(dāng)前新的研究熱點(diǎn)。但目前固體柜產(chǎn)品中很大一部分環(huán)氧澆注外表面未做金屬化處理,文中對(duì)現(xiàn)有12 kV固體柜產(chǎn)品環(huán)氧澆注模塊外表面無(wú)金屬化處理時(shí)的電場(chǎng)分布特征進(jìn)行了仿真研究。仿真結(jié)果表明,現(xiàn)有固體柜產(chǎn)品環(huán)氧澆注模塊外表面無(wú)金屬化層時(shí),固體柜能夠滿足電場(chǎng)絕緣考核要求,但環(huán)氧澆注模塊內(nèi)部真空滅弧室結(jié)構(gòu)及環(huán)氧模塊與柜體外殼間隙距離對(duì)固體柜的電場(chǎng)分布影響顯著。

   
Solid insulation technology has been widely used in medium voltage, especially 12 kV switchgears. For the purpose of miniaturization, weather ability and safety of the solid insulated switchgear(SIS), metallization treatment on insulation surface has attracted more attention in corresponding researches. However, a large proportion of the commonly used SISs are not treated by metallization on the outer surface of epoxy mold. In this study ,the electric field distribution characteristics on the epoxy mold of the 12 kV switchgear without surface metallization are simulated. The results show that the SISs without metallization on epoxy mold surface can satisfy the requirement for electric field assessment, but the internal vacuum interrupter structure in epoxy mold and the distance between epoxy mold and cabinet shell have significant influence on a SIS electric field distribution.
 
 
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